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On the factors affecting the metal etching speed

Author: Source: Date:2019/1/18 10:16:11
Information digest:
In the process of etching, as long as the metal etching, the etching speed is a very concerned problem.All want to etch fast, reduce the production time, but the etch speed is not the faster the better, this should have...

In the process of etching, as long as the metal etching, the etching speed is a very concerned problem.All want to etch fast, reduce the production time, but the etch speed is not the faster the better.This needs to be analyzed on a case by case basis, which is the requirement of depth and etched surface state, in which the key is the etched depth.For a product requiring chemical etching, whether deep or shallow etching is required, there is a common principle, that is, depth uniformity.The uniformity of etching depth is mainly affected by four aspects: material, etching solution, physical parameters of etching process and etching time.When the metal needs to be etched to a deeper depth, the factor of the material is not important (with the exception of the material's poor quality).At the same time, in order to improve the production efficiency, it is necessary to adjust the etching solution concentration, formula composition and etching physical parameters to improve the etching speed, even this does not need "the faster the better the etching speed".Because too fast a speed will make the solution composition change too fast, which will in turn affect the difficulty of controlling physical parameters, and at the same time will make the dissolution rate of the etched metal surface not consistent, reducing the smoothness of the etched surface.Etching of common metal materials in the existing technical level completely can do high etching rate, can be more than 0.1 m/min, so fast the need stronger corrosion ability of formulation and higher temperature, in order to maintain the relatively stable of solution composition can use large volume or automatic analysis technique, but here there is a corrosion protective layer can be used for batch production the problem of how to make, this book must be told by mass production instead of lab work.Therefore, fast etching speed is only a relative concept. On the premise of easy control, acceptable production cost of anti-corrosion layer and even etching depth, faster etching speed is meaningful.

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For etching materials with shallow depth, the surface state and particle structure will affect the depth uniformity. At the same time, if the etching solution and physical parameters are adjusted to fast etching speed, the uniformity will not be controlled.For the etch depth of more than mm, the etch speed of 0.05mm/min will be considered too slow in production.If the etching depth is 0.035m, the etching speed of 0.0lmm/mim will be considered too fast.Because metal etching does not unfold across the surface of the metal at the same time as it is supposed to.For the passivation of the material surface and other factors some parts of the metal etching will have a late effect, especially for stainless steel etching this phenomenon is more obvious.

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Another important factor that affects the etching speed is the tolerance. The faster the speed, the more difficult it is to control the accuracy of the tolerance.For example, when a workpiece requires a tolerance of 0.00m, the etching speed should be determined when designing the etching process. Of course, the tolerance must correspond to the depth.


To sum up, it can be known that the main factors affecting the determination of etching speed are etching depth requirements and tolerance requirements.For the workpiece with a large etching depth, the process scheme with a high etching speed can be designed. When the tolerance is high, the method of fractional etching can be adopted, that is, the high etching speed method is adopted first, and the low etching speed method is adopted to ensure the tolerance when the depth is close to the design requirement.For the workpiece with shallow etch depth and strict tolerance, the process method with slower etch speed should be adopted.

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